Tips to prevent overheating the connect module

HDL310 and HDL410 audio conferencing systems
Last Updated: May 4th, 2023

Preventing overheating

  • Do not block the vents on the top, bottom or back of the connect module
  • Ensure adequate space between all vents and other objects to promote airflow and cooling
  • These vents require airflow around the device to keep the circuits from overheating
  • A minimum of 2 inches (5 centimeters) clearance around the device is recommended 
  • Avoid locations where ambient air reaches temperatures greater than 40o Celcius 
  • Avoid installing the connect module in a confined space
  • Avoid rack mounting the device
  • Avoid installing close to other devices that generate heat

Vents require a minimum of 2" (5 cm) clearance for airflow around the device to avoid overheating.

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